Si Ping HU

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,010,838
- Issue date Jun 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,996,322
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 11,791,265
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding contacts having capping layer and method for forming the same
- Patent number 11,715,718
- Issue date Aug 1, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,670,543
- Issue date Jun 6, 2023
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,462,503
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 11,322,392
- Issue date May 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 11,276,642
- Issue date Mar 15, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 11,205,619
- Issue date Dec 21, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding contacts having capping layer and method for forming the same
- Patent number 11,177,231
- Issue date Nov 16, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 11,145,666
- Issue date Oct 12, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line contact structure for three-dimensional memory devices an...
- Patent number 11,101,276
- Issue date Aug 24, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 11,056,387
- Issue date Jul 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,049,834
- Issue date Jun 29, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 10,833,042
- Issue date Nov 10, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 10,796,993
- Issue date Oct 6, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming lead wires in hybrid-bonded semiconductor devices
- Patent number 10,763,158
- Issue date Sep 1, 2020
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 10,748,851
- Issue date Aug 18, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 10,680,003
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 10,679,941
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line contact structure for three-dimensional memory devices an...
- Patent number 10,672,711
- Issue date Jun 2, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 10,651,087
- Issue date May 12, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three-dimensional integrated wiring structure an...
- Patent number 10,607,887
- Issue date Mar 31, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 10,580,788
- Issue date Mar 3, 2020
- Yangtze Memory Technologies, Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20230317665
- Publication date Oct 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20230084008
- Publication date Mar 16, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20230083030
- Publication date Mar 16, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20220270919
- Publication date Aug 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20220216099
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20220208677
- Publication date Jun 30, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20220173038
- Publication date Jun 2, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20210091033
- Publication date Mar 25, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20210072653
- Publication date Mar 11, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20210035941
- Publication date Feb 4, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20200402841
- Publication date Dec 24, 2020
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20200381360
- Publication date Dec 3, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200335450
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20200295019
- Publication date Sep 17, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20200266147
- Publication date Aug 20, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE CONTACT STRUCTURE FOR THREE-DIMENSIONAL MEMORY DEVICES AN...
- Publication number 20200258837
- Publication date Aug 13, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200243455
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20200243473
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20200159133
- Publication date May 21, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Meng Yan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20200152515
- Publication date May 14, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
- Publication number 20200051945
- Publication date Feb 13, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20200027892
- Publication date Jan 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE CONTACT STRUCTURE FOR THREE-DIMENSIONAL MEMORY DEVICES AN...
- Publication number 20190096810
- Publication date Mar 28, 2019
- Yangtze Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES
- Publication number 20190088535
- Publication date Mar 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20190081070
- Publication date Mar 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20190067196
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20190067105
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...
- Publication number 20190067106
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Staircase structure for memory device

Staircase structure for memory device

Method for forming lead wires in hybrid-bonded semiconductor devices

Bonding alignment marks at bonding interface

Method for forming three-dimensional integrated wiring structure an...

Bonding contacts having capping layer and method for forming the same

Method for forming lead wires in hybrid-bonded semiconductor devices

Hybrid bonding using dummy bonding contacts

Method for forming lead wires in hybrid-bonded semiconductor devices

Bonding alignment marks at bonding in interface

Method for forming three-dimensional integrated wiring structure an...

Hybrid bonding using dummy bonding contacts and dummy interconnects

Bonding contacts having capping layer and method for forming the same

Staircase structure for memory device

Word line contact structure for three-dimensional memory devices an...

Method for forming three-dimensional integrated wiring structure an...

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts

Method for forming three-dimensional integrated wiring structure an...

Method for forming lead wires in hybrid-bonded semiconductor devices

Hybrid bonding using dummy bonding contacts and dummy interconnects

Staircase structure for memory device

Method for forming three-dimensional integrated wiring structure an...

Word line contact structure for three-dimensional memory devices an...

Method for forming three-dimensional integrated wiring structure an...

Method for forming three-dimensional integrated wiring structure an...

Methods for forming three-dimensional memory devices

Patents Applicationslast 30 patents

STAIRCASE STRUCTURE FOR MEMORY DEVICE

BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME

STAIRCASE STRUCTURE FOR MEMORY DEVICE

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

HYBRID BONDING USING DUMMY BONDING CONTACTS

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

WORD LINE CONTACT STRUCTURE FOR THREE-DIMENSIONAL MEMORY DEVICES AN...

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

HYBRID BONDING USING DUMMY BONDING CONTACTS

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME

METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES

WORD LINE CONTACT STRUCTURE FOR THREE-DIMENSIONAL MEMORY DEVICES AN...

METHOD FOR FORMING LEAD WIRES IN HYBRID-BONDED SEMICONDUCTOR DEVICES

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED WIRING STRUCTURE AN...