Si-Ty Lam

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Etching process to selectively remove copper plating seed layer
- Patent number 6,767,477
- Issue date Jul 27, 2004
- Headway Technologies, Inc.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching process to selectively remove copper plating seed layer
- Patent number 6,428,719
- Issue date Aug 6, 2002
- Headway Technologies, Inc.
- Xuehua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Orifice plate for an ink-jet pen
- Patent number 5,434,606
- Issue date Jul 18, 1995
- Hewlett-Packard Corporation
- Suraj L. Hindagolla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Three dimensional nozzle orifice plates
- Patent number 5,255,017
- Issue date Oct 19, 1993
- Hewlett-Packard Company
- Si-Ty Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for continuously electroforming parts such as inkjet orific...
- Patent number 5,236,572
- Issue date Aug 17, 1993
- Hewlett-Packard Company
- Si-Ty Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Contact cooling of a projection mask
- Patent number 5,142,120
- Issue date Aug 25, 1992
- Hewlett-Packard Company
- Eric G. Hanson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integral ink jet print head
- Patent number 5,016,024
- Issue date May 14, 1991
- Hewlett-Packard Company
- Si-Ty Lam
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thin film mandrel
- Patent number 4,773,971
- Issue date Sep 27, 1988
- Hewlett-Packard Company
- Si-Ty Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Etching process to selectively remove copper plating seed layer
- Publication number 20020168223
- Publication date Nov 14, 2002
- HEADWAY TECHNOLOGIES, INC.
- Xue Hua Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Etching process to selectively remove copper plating seed layer

Etching process to selectively remove copper plating seed layer

Orifice plate for an ink-jet pen

Three dimensional nozzle orifice plates

Process for continuously electroforming parts such as inkjet orific...

Contact cooling of a projection mask

Integral ink jet print head

Thin film mandrel

Patents Applicationslast 30 patents

Etching process to selectively remove copper plating seed layer