Sian Yong Khoo

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Double bumping of flexible substrate for first and second level int...
- Patent number 7,320,933
- Issue date Jan 22, 2008
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BOC BGA package for die with I-shaped bond pad layout
- Patent number 7,112,048
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC BGA package for die with I-shaped bond pad layout
- Patent number 6,720,666
- Issue date Apr 13, 2004
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC BGA package for die with I-shaped bond pad layout
- Patent number 6,692,987
- Issue date Feb 17, 2004
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density single inline memory module
- Patent number 5,956,233
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Double bumping of flexible substrate for first and second level int...
- Publication number 20040198033
- Publication date Oct 7, 2004
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double bumping of flexible substrate for first and second level int...
- Publication number 20040036170
- Publication date Feb 26, 2004
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOC BGA package for die with I-shaped bond pad layout
- Publication number 20030211659
- Publication date Nov 13, 2003
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOC BGA package for die with I-shaped bond pad layout
- Publication number 20030211660
- Publication date Nov 13, 2003
- Micron Technology, Inc.
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOC BGA package for die with I-shaped bond pad layout
- Publication number 20030148557
- Publication date Aug 7, 2003
- Thiam Chye Lim
- H01 - BASIC ELECTRIC ELEMENTS