Siddarth Kumar

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming flexure based cooling solutions for package stru...
- Patent number 11,276,625
- Issue date Mar 15, 2022
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress isolation for silicon photonic applications
- Patent number 10,748,844
- Issue date Aug 18, 2020
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage controlled package and method for same
- Patent number 9,953,934
- Issue date Apr 24, 2018
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit on flexible substrate
- Patent number 9,930,793
- Issue date Mar 27, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management for flexible integrated circuit packages
- Patent number 9,735,089
- Issue date Aug 15, 2017
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for package on package through mold interconnects
- Patent number 9,659,908
- Issue date May 23, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...
- Publication number 20210280495
- Publication date Sep 9, 2021
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS ISOLATION FOR SILICON PHOTONIC APPLICATIONS
- Publication number 20190206782
- Publication date Jul 4, 2019
- Intel Corporation
- Siddarth KUMAR
- G02 - OPTICS
Information Patent Application
WARPAGE CONTROLLED PACKAGE AND METHOD FOR SAME
- Publication number 20170178987
- Publication date Jun 22, 2017
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT FOR FLEXIBLE INTEGRATED CIRCUIT PACKAGES
- Publication number 20170092564
- Publication date Mar 30, 2017
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC CIRCUIT ON FLEXIBLE SUBSTRATE
- Publication number 20150282341
- Publication date Oct 1, 2015
- Intel Corporation
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR