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Sidney Larry Anderson
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating an integrated circuit package utilizing a con...
Patent number
6,929,978
Issue date
Aug 16, 2005
Altera Corporation
Sidney Larry Anderson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package with improved thermal cycling performance, an...
Patent number
6,627,517
Issue date
Sep 30, 2003
Altera Corporation
Eng-Chew Cheah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package utilizing a conductive structure for int...
Patent number
6,462,414
Issue date
Oct 8, 2002
Altera Corporation
Sidney Larry Anderson
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Fabrication method and structure of an integrated circuit package
Publication number
20020194731
Publication date
Dec 26, 2002
Altera Corporation
Sidney Larry Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for integrated circuit package
Publication number
20020145207
Publication date
Oct 10, 2002
Sidney Larry Anderson
H01 - BASIC ELECTRIC ELEMENTS