Siegfried WALTER

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Gelnhausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Strip-shaped substrate for producing chip carriers, electronic modu...
- Patent number 9,941,197
- Issue date Apr 10, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eckhard Ditzel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laminated substrates for mounting electronic parts and methods for...
- Patent number 8,153,232
- Issue date Apr 10, 2012
- W. C. Heraeus GmbH
- Eckhard Ditzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODU...
- Publication number 20170133313
- Publication date May 11, 2017
- Heraeus Deutschland GmbH & Co. KG
- Eckhard DITZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PARTIAL LAMINATION OF FLEXIBLE SUBSTRATES
- Publication number 20130316122
- Publication date Nov 28, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Manfred Gresch
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED SUBSTRATES FOR MOUNTING ELECTRONIC PARTS AND METHODS FOR...
- Publication number 20080220202
- Publication date Sep 11, 2008
- W.C. Heraeus GmbH
- Eckhard DITZEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR