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Beijing, CN
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last 30 patents
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Patent Grant
Cluster communictaion
Patent number
10,644,991
Issue date
May 5, 2020
New H3C Technologies Co., Ltd.
Sijie Li
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
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Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240266245
Publication date
Aug 8, 2024
Beijing Youzhuju Network Technology Co., Ltd.
Sijie LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CLUSTER COMMUNICATION
Publication number
20180198702
Publication date
Jul 12, 2018
New H3C Technologies Co., Ltd.
Sijie Li
H04 - ELECTRIC COMMUNICATION TECHNIQUE