Sijoong Yang

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Suwon-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250029904
- Publication date Jan 23, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022779
- Publication date Jan 16, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus and method thereof
- Publication number 20110290860
- Publication date Dec 1, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong Yang
- H01 - BASIC ELECTRIC ELEMENTS