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Sim Ying Yong
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Ball grid array packaged camera device soldered to a substrate
Patent number
9,231,124
Issue date
Jan 5, 2016
Delphi Technologies, Inc.
Binghua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wrap-around overmold for electronic assembly
Patent number
7,616,448
Issue date
Nov 10, 2009
Delphi Technologies, Inc.
Thomas A. Degenkolb
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Overmolded electronic assembly
Patent number
7,462,077
Issue date
Dec 9, 2008
Delphi Technologies, Inc.
Kin Yean Chow
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Overmolded electronic assembly with metal seal ring
Patent number
7,455,552
Issue date
Nov 25, 2008
Delphi Technologies, Inc.
Ching Meng Fang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Discrete electronic component arrangement including anchoring, ther...
Patent number
7,148,554
Issue date
Dec 12, 2006
Delphi Technologies, Inc.
Chih Kai Nah
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MOLDED CAMERA
Publication number
20160006908
Publication date
Jan 7, 2016
Delphi Technologies, Inc.
BINGHUA PAN
B60 - VEHICLES IN GENERAL
Information
Patent Application
BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE
Publication number
20150084150
Publication date
Mar 26, 2015
BINGHUA PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interlocking overmold for electronic assembly
Publication number
20090197478
Publication date
Aug 6, 2009
Larry M. Mandel
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wrap-around overmold for electronic assembly
Publication number
20090073663
Publication date
Mar 19, 2009
Thomas A. Degenkolb
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Overmolded electronic assembly
Publication number
20080124987
Publication date
May 29, 2008
Kin Yean Chow
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISCRETE ELECTRONIC COMPONENT ARRANGEMENT INCLUDING ANCHORING, THER...
Publication number
20060131732
Publication date
Jun 22, 2006
Chih Kai Nah
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Electronic module with conductive polymer
Publication number
20060044771
Publication date
Mar 2, 2006
Chee Keng Yeo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit board surface mount package
Publication number
20050173152
Publication date
Aug 11, 2005
Scott E. Post
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...