Simon Chan

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Zhuhai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronic structure with through thickness coaxial stru...
- Patent number 9,185,793
- Issue date Nov 10, 2015
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic structure with stepped holes
- Patent number 9,161,461
- Issue date Oct 13, 2015
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment between layers of multilayer electronic support structures
- Patent number 9,137,905
- Issue date Sep 15, 2015
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC STRUCTURE WITH STEPPED HOLES
- Publication number 20130333934
- Publication date Dec 19, 2013
- DROR HURWITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC STRUCTURE WITH THROUGH THICKNESS COAXIAL STRU...
- Publication number 20130319738
- Publication date Dec 5, 2013
- DROR HURWITZ
- H01 - BASIC ELECTRIC ELEMENTS