Simon Ehrenschwendtner

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Winhoring, DE

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Patents Grantslast 30 patents

Information Patent Grant
Process for the material-abrading machining of the edge of a semico...
- Patent number 6,045,436
- Issue date Apr 4, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Alexander Rieger
- B24 - GRINDING POLISHING