Simon John Molloy

Person

Allentown, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated channel diode
- Patent number 11,444,191
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium high voltage MOSFET device
- Patent number 10,811,533
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated channel diode
- Patent number 10,741,684
- Issue date Aug 11, 2020
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical high-voltage MOS transistor
- Patent number 10,573,718
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium voltage MOSFET device
- Patent number 10,553,717
- Issue date Feb 4, 2020
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple shielding trench gate FET
- Patent number 10,541,326
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 10,438,936
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 10,153,220
- Issue date Dec 11, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,121,716
- Issue date Nov 6, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded electronic system having stacked semic...
- Patent number 10,109,614
- Issue date Oct 23, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,062,624
- Issue date Aug 28, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,859,261
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 9,818,662
- Issue date Nov 14, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power FET with integrated sensors and method of manufacturing
- Patent number 9,748,376
- Issue date Aug 29, 2017
- Texas Instruments Incorporated
- David J Baldwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 9,721,860
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple shielding trench gate FET
- Patent number 9,711,639
- Issue date Jul 18, 2017
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated termination for multiple trench field plate
- Patent number 9,673,317
- Issue date Jun 6, 2017
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,640,519
- Issue date May 2, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical high-voltage MOS transistor and method of forming the same
- Patent number 9,525,035
- Issue date Dec 20, 2016
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated channel diode
- Patent number 9,484,450
- Issue date Nov 1, 2016
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated termination for multiple trench field plate
- Patent number 9,450,082
- Issue date Sep 20, 2016
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium voltage MOSFET device
- Patent number 9,356,133
- Issue date May 31, 2016
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded electronic system having stacked semic...
- Patent number 9,305,852
- Issue date Apr 5, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple shielding trench gate fet
- Patent number 9,299,830
- Issue date Mar 29, 2016
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET with curved trench feature coupling termination trench to ac...
- Patent number 9,245,994
- Issue date Jan 26, 2016
- Texas Instruments Incorporated
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of polysilicon residue in a trench for polysilicon trench...
- Patent number 9,230,851
- Issue date Jan 5, 2016
- Texas Instruments Incorporated
- Simon John Molloy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super junction MOSFET with integrated channel diode
- Patent number 9,136,381
- Issue date Sep 15, 2015
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual RESURF trench field plate in vertical MOSFET
- Patent number 8,748,976
- Issue date Jun 10, 2014
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage channel diode
- Patent number 8,294,210
- Issue date Oct 23, 2012
- Texas Instruments Incorporated
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CHANNEL DIODE
- Publication number 20200373424
- Publication date Nov 26, 2020
- TEXAS INSTRUMENTS INCORPORATED
- CHRISTOPHER BOGUSLAW KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20190385992
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20180096978
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...
- Publication number 20180040527
- Publication date Feb 8, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301595
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301596
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Shielding Trench Gate FET
- Publication number 20170288052
- Publication date Oct 5, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20170194306
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power FET With Integrated Sensors And Method Of Manufacturing
- Publication number 20170179278
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- David J Baldwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH-VOLTAGE MOS TRANSISTOR
- Publication number 20170062573
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- CHRISTOPHER BOGUSLAW KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHANNEL DIODE
- Publication number 20170025525
- Publication date Jan 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- CHRISTOPHER BOGUSLAW KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TERMINATION FOR MULTIPLE TRENCH FIELD PLATE
- Publication number 20160359039
- Publication date Dec 8, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Hideaki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Shielding Trench Gate FET
- Publication number 20160329423
- Publication date Nov 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Hideaki Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Medium High Voltage MOSFET Device
- Publication number 20160240653
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Boguslaw KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMIC...
- Publication number 20160172338
- Publication date Jun 16, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH-VOLTAGE MOS TRANSISTOR AND METHOD OF FORMING THE MOS...
- Publication number 20160163804
- Publication date Jun 9, 2016
- TEXAS INSTRUMENTS INCORPORATED
- CHRISTOPHER BOGUSLAW KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20160133534
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...
- Publication number 20160133535
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20160133616
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TERMINATION FOR MULTIPLE TRENCH FIELD PLATE
- Publication number 20150357461
- Publication date Dec 10, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Hideaki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHANNEL DIODE
- Publication number 20150357459
- Publication date Dec 10, 2015
- TEXAS INSTRUMENTS INCORPORATED
- CHRISTOPHER BOGUSLAW KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET WITH CURVED TRENCH FEATURE COUPLING TERMINATION TRENCH TO AC...
- Publication number 20140217497
- Publication date Aug 7, 2014
- TEXAS INSTRUMENTS INCORPORATED
- HIDEAKI KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF POLYSILICON RESIDUE IN A TRENCH FOR POLYSILICON TRENCH...
- Publication number 20140220761
- Publication date Aug 7, 2014
- TEXAS INSTRUMENTS INCORPORATED
- SIMON JOHN MOLLOY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEDIUM VOLTAGE MOSFET DEVICE
- Publication number 20130193502
- Publication date Aug 1, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Boguslaw KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE CHANNEL DIODE
- Publication number 20110303976
- Publication date Dec 15, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Boguslaw KOCON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POWER INTEGRATED CIRCUIT
- Publication number 20100315159
- Publication date Dec 16, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Boguslaw Kocon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET DEVICE HAVING DUAL INTERLEVEL DIELECTRIC THICKNESS AND METHO...
- Publication number 20090267145
- Publication date Oct 29, 2009
- CICLON SEMICONDUCTOR DEVICE CORP.
- Charles Walter Pearce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Formed Using a Sacrificial Structure
- Publication number 20080054481
- Publication date Mar 6, 2008
- Bailey R. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure formed using a sacrificial structure
- Publication number 20060226552
- Publication date Oct 12, 2006
- Bailey R. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization performance in electronic devices
- Publication number 20060038294
- Publication date Feb 23, 2006
- John C. Desko
- H01 - BASIC ELECTRIC ELEMENTS

Simon John Molloy

Person

Patents Grantslast 30 patents

Integrated channel diode

Photo-sensitive silicon package embedding self-powered electronic s...

Medium high voltage MOSFET device

Integrated channel diode

Vertical high-voltage MOS transistor

Medium voltage MOSFET device

Multiple shielding trench gate FET

Photo-sensitive silicon package embedding self-powered electronic s...

Silicon package having electrical functionality by embedded passive...

Silicon package for embedded semiconductor chip and power converter

Silicon package for embedded electronic system having stacked semic...

Silicon package for embedded semiconductor chip and power converter

Photo-sensitive silicon package embedding self-powered electronic s...

Silicon package having electrical functionality by embedded passive...

Power FET with integrated sensors and method of manufacturing

Silicon package for embedded semiconductor chip and power converter

Multiple shielding trench gate FET

Integrated termination for multiple trench field plate

Photo-sensitive silicon package embedding self-powered electronic s...

Vertical high-voltage MOS transistor and method of forming the same

Integrated channel diode

Integrated termination for multiple trench field plate

Medium voltage MOSFET device

Silicon package for embedded electronic system having stacked semic...

Multiple shielding trench gate fet

MOSFET with curved trench feature coupling termination trench to ac...

Reduction of polysilicon residue in a trench for polysilicon trench...

Super junction MOSFET with integrated channel diode

Dual RESURF trench field plate in vertical MOSFET

High voltage channel diode

Patents Applicationslast 30 patents

INTEGRATED CHANNEL DIODE

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

Multiple Shielding Trench Gate FET

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

Power FET With Integrated Sensors And Method Of Manufacturing

VERTICAL HIGH-VOLTAGE MOS TRANSISTOR

INTEGRATED CHANNEL DIODE

INTEGRATED TERMINATION FOR MULTIPLE TRENCH FIELD PLATE

Multiple Shielding Trench Gate FET

Medium High Voltage MOSFET Device

SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMIC...

VERTICAL HIGH-VOLTAGE MOS TRANSISTOR AND METHOD OF FORMING THE MOS...

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

INTEGRATED TERMINATION FOR MULTIPLE TRENCH FIELD PLATE

INTEGRATED CHANNEL DIODE

MOSFET WITH CURVED TRENCH FEATURE COUPLING TERMINATION TRENCH TO AC...

REDUCTION OF POLYSILICON RESIDUE IN A TRENCH FOR POLYSILICON TRENCH...

MEDIUM VOLTAGE MOSFET DEVICE

HIGH VOLTAGE CHANNEL DIODE

HIGH VOLTAGE POWER INTEGRATED CIRCUIT

MOSFET DEVICE HAVING DUAL INTERLEVEL DIELECTRIC THICKNESS AND METHO...

Semiconductor Structure Formed Using a Sacrificial Structure

Semiconductor structure formed using a sacrificial structure

Metallization performance in electronic devices