Simon Lee

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Testing module for testing the strength of the welding area on a PCB
- Patent number 6,234,029
- Issue date May 22, 2001
- Advanced Semiconductor Engineering, Inc.
- Ming-Shuoh Liang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball bonding method on a chip
- Patent number 6,176,417
- Issue date Jan 23, 2001
- Advanced Semiconductor Engineering Inc.
- Yu-Fang Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR