SIMON MCELREA

Person

  • ORANGE, CA, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of making a multi-layer interconnect

    • Patent number 6,607,939
    • Issue date Aug 19, 2003
    • Honeywell International Inc.
    • Richard Pommer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Multi-layer interconnect

    • Patent number 6,388,325
    • Issue date May 14, 2002
    • AlliedSignal Inc.
    • Richard Pommer
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Multi-layer interconnect

    • Publication number 20040124534
    • Publication date Jul 1, 2004
    • Richard Pommer
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multi-layer interconnect

    • Publication number 20020092159
    • Publication date Jul 18, 2002
    • Richard Pommer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER INTERCONNECT

    • Publication number 20020003303
    • Publication date Jan 10, 2002
    • RICHARD POMMER
    • H01 - BASIC ELECTRIC ELEMENTS