Simon Shi-Ning Yang

Person

Hubei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 11,805,646
- Issue date Oct 31, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,758,732
- Issue date Sep 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a plurality of NAND strings...
- Patent number 11,699,657
- Issue date Jul 11, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,527,547
- Issue date Dec 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a plurality of NAND strings
- Patent number 11,462,474
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source structure of three-dimensional memory device and method for...
- Patent number 11,264,397
- Issue date Mar 1, 2022
- Yangtze Memory Technologies Co., Ltd.
- Yushi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 11,211,397
- Issue date Dec 28, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a plurality of NAND strings
- Patent number 11,031,333
- Issue date Jun 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,998,079
- Issue date May 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,923,491
- Issue date Feb 16, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source structure of three-dimensional memory device and method for...
- Patent number 10,804,279
- Issue date Oct 13, 2020
- Yangtze Memory Technologies Co., Ltd.
- Yushi Hu
- G11 - INFORMATION STORAGE
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,679,721
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,593,690
- Issue date Mar 17, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 10,522,474
- Issue date Dec 31, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dropout regulators
- Patent number 10,423,176
- Issue date Sep 24, 2019
- Yangtze Memory Technologies Co., Ltd.
- Feng Pan
- G05 - CONTROLLING REGULATING
Information Patent Grant
Three-dimensional memory devices having a plurality of NAND strings
- Patent number 10,283,452
- Issue date May 7, 2019
- Yangtze Memory Technology Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source structure of three-dimensional memory device and method for...
- Patent number 10,147,732
- Issue date Dec 4, 2018
- Yangtze Memory Technologies Co., Ltd.
- Yushi Hu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20230422504
- Publication date Dec 28, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230363169
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230087468
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230070357
- Publication date Mar 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20230069096
- Publication date Mar 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS
- Publication number 20210296341
- Publication date Sep 23, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20210134826
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Memory Devices and Methods for Forming the Same
- Publication number 20210098491
- Publication date Apr 1, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR...
- Publication number 20210005621
- Publication date Jan 7, 2021
- Yangtze Memory Technologies Co., Ltd.
- Yushi HU
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200295025
- Publication date Sep 17, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200265913
- Publication date Aug 20, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200203285
- Publication date Jun 25, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS
- Publication number 20190244893
- Publication date Aug 8, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS
- Publication number 20190244892
- Publication date Aug 8, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR...
- Publication number 20190164983
- Publication date May 30, 2019
- Yangtze Memory Technologies Co., Ltd.
- Yushi HU
- G11 - INFORMATION STORAGE
Information Patent Application
Three-Dimensional Memory Devices and Methods for Forming the Same
- Publication number 20190088589
- Publication date Mar 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jifeng ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20190081069
- Publication date Mar 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-DROPOUT REGULATORS
- Publication number 20190064862
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Feng PAN
- G05 - CONTROLLING REGULATING
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190057756
- Publication date Feb 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190057974
- Publication date Feb 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190051610
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Simon Shi-Ning Yang

Person

Patents Grantslast 30 patents

Memory devices having vertical transistors and methods for forming...

Staircase etch control in forming three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices and methods for forming the same

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices having a plurality of NAND strings...

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices having a plurality of NAND strings

Source structure of three-dimensional memory device and method for...

Three-dimensional memory devices and methods for forming the same

Three-dimensional memory devices having a plurality of NAND strings

Structure and method for testing three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Source structure of three-dimensional memory device and method for...

Structure and method for testing three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Staircase etch control in forming three-dimensional memory device

Low-dropout regulators

Three-dimensional memory devices having a plurality of NAND strings

Source structure of three-dimensional memory device and method for...

Patents Applicationslast 30 patents

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

Three-Dimensional Memory Devices and Methods for Forming the Same

SOURCE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS

THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS

SOURCE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR...

Three-Dimensional Memory Devices and Methods for Forming the Same

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

LOW-DROPOUT REGULATORS

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE