Simon Su-Horng Lin

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of bottom-up metal film deposition
- Patent number 9,214,543
- Issue date Dec 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Simon Su-Horng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
N/P metal crystal orientation for high-K metal gate Vt modulation
- Patent number 8,674,451
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Simon Su-Horng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of bottom-up metal film deposition
- Patent number 8,466,063
- Issue date Jun 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Simon Su-Horng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch stop layer
- Patent number 7,375,040
- Issue date May 20, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Simon S. H. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to improve barrier layer performance over porous l...
- Patent number 7,176,141
- Issue date Feb 13, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Simon Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low voltage differential signaling device with feedback compensation
- Patent number 7,030,656
- Issue date Apr 18, 2006
- VIA Technologies, Inc
- Hua-Jan Lo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF BOTTOM-UP METAL FILM DEPOSITION
- Publication number 20130270617
- Publication date Oct 17, 2013
- Simon Su-Horng LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch stop layer
- Publication number 20060110938
- Publication date May 25, 2006
- Simon S.H. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment to improve barrier layer performance over porous l...
- Publication number 20060051947
- Publication date Mar 9, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Simon Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low voltage differential signaling device with feedback compensation
- Publication number 20040150634
- Publication date Aug 5, 2004
- Hua-Jan Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Etch stop layer
- Publication number 20040124420
- Publication date Jul 1, 2004
- Simon S.H. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Simon Su-Horng Lin

Person

Patents Grantslast 30 patents

Integration of bottom-up metal film deposition

N/P metal crystal orientation for high-K metal gate Vt modulation

Integration of bottom-up metal film deposition

Etch stop layer

Plasma treatment to improve barrier layer performance over porous l...

Low voltage differential signaling device with feedback compensation

Patents Applicationslast 30 patents

INTEGRATION OF BOTTOM-UP METAL FILM DEPOSITION

Etch stop layer

Plasma treatment to improve barrier layer performance over porous l...

Low voltage differential signaling device with feedback compensation

Etch stop layer