Simone Comensoli

Person

Darfo Boario Terme, IT

People

Patents Grantslast 30 patents

Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,107,804
- Issue date Aug 31, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,476
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,477
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 11,075,194
- Issue date Jul 27, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,018,126
- Issue date May 25, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 10,978,438
- Issue date Apr 13, 2021
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,854,522
- Issue date Dec 1, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures embedded within a contiguous standard cell...
- Patent number 10,777,472
- Issue date Sep 15, 2020
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making semiconductor dies, chips, and wafers using in-l...
- Patent number 10,593,604
- Issue date Mar 17, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
Methods for processing a semiconductor wafer using non-contact elec...
- Patent number 10,290,552
- Issue date May 14, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit containing first and second DOEs of standard Cel...
- Patent number 10,269,786
- Issue date Apr 23, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,112
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,111
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,290
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,284
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,285
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,288
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor water using non-contact elect...
- Patent number 10,199,293
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wager using non-contact elect...
- Patent number 10,199,283
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,287
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,294
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,286
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,289
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including NCEM-enabled, tip-to-side gap-configur...
- Patent number 10,109,539
- Issue date Oct 23, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,529
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,530
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit containing DOEs of GATECNT-tip-to-side-short-con...
- Patent number 9,984,944
- Issue date May 29, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making semiconductor dies, chips, and wafers using non-...
- Patent number 9,953,889
- Issue date Apr 24, 2018
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including NCEM-enabled, side-to-side gap-configu...
- Patent number 9,947,601
- Issue date Apr 17, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making an integrated circuit that includes NCEM-Enabled...
- Patent number 9,929,063
- Issue date Mar 27, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells
- Publication number 20170178981
- Publication date Jun 22, 2017
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS

Simone Comensoli

Person

Patents Grantslast 30 patents

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

Method for processing a semiconductor wafer using non-contact elect...

IC with test structures embedded within a contiguous standard cell...

Process for making semiconductor dies, chips, and wafers using in-l...

Methods for processing a semiconductor wafer using non-contact elec...

Integrated circuit containing first and second DOEs of standard Cel...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor water using non-contact elect...

Method for processing a semiconductor wager using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Integrated circuit including NCEM-enabled, tip-to-side gap-configur...

Process for making and using a semiconductor wafer containing first...

Process for making and using a semiconductor wafer containing first...

Integrated circuit containing DOEs of GATECNT-tip-to-side-short-con...

Process for making semiconductor dies, chips, and wafers using non-...

Integrated circuit including NCEM-enabled, side-to-side gap-configu...

Process for making an integrated circuit that includes NCEM-Enabled...

Patents Applicationslast 30 patents

Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells