Sin-Hua Ho

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting diode package
- Patent number 8,552,439
- Issue date Oct 8, 2013
- Himax Display, Inc.
- Yuet-Wing Li
- F21 - LIGHTING
Information Patent Grant
Packaging method of wafer level chips
- Patent number 8,227,271
- Issue date Jul 24, 2012
- Himax Technologies Limited
- Sin-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE OF A WAFER LEVEL SUBSTRATE FOR CARRYING LIGHT EMITTING DE...
- Publication number 20120319292
- Publication date Dec 20, 2012
- HIMAX TECHNOLOGIES LIMITED
- Sin-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE
- Publication number 20120256217
- Publication date Oct 11, 2012
- HIMAX TECHNOLOGIES LIMITED
- Yuet-Wing Li
- G02 - OPTICS
Information Patent Application
PACKAGING METHOD OF WAFER LEVEL CHIPS
- Publication number 20120196393
- Publication date Aug 2, 2012
- HIMAX TECHNOLOGIES LIMITED
- Sin-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS