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last 30 patents
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Patent Grant
Semiconductor chip package and method of manufacture
Patent number
7,678,610
Issue date
Mar 16, 2010
UTAC - United Test and Assembly Test Center Ltd.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
Publication number
20080251938
Publication date
Oct 16, 2008
UTAC - United Test and Assembly Center LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple stacked die window csp package and method of manufacture
Publication number
20070132081
Publication date
Jun 14, 2007
United Test & Assembly Center Limited
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip package and method of manufacture
Publication number
20060192292
Publication date
Aug 31, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS