Sin-Shong WANG

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising a thermally conductive connector compr...
- Patent number 11,744,045
- Issue date Aug 29, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device comprising thermally conductive connector
- Patent number 11,733,749
- Issue date Aug 22, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated device coupled to a step heat sink configured to provide...
- Patent number 11,637,051
- Issue date Apr 25, 2023
- QUALCOMM Incorporated
- Hung-Wen Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING A THERMALLY CONDUCTIVE CONNECTOR COMPR...
- Publication number 20230145773
- Publication date May 11, 2023
- QUALCOMM Incorporated
- Hung-Wen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING THERMALLY CONDUCTIVE CONNECTOR
- Publication number 20210373628
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Hung-Wen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED DEVICE COUPLED TO A STEP HEAT SINK CONFIGURED TO PROVIDE...
- Publication number 20210118764
- Publication date Apr 22, 2021
- QUALCOMM Incorporated
- Hung-Wen LIN
- G06 - COMPUTING CALCULATING COUNTING