Sing-Da JIANG

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Hsinchu, TW

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...
- Publication number 20250233047
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
- Publication number 20250096071
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsunyen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS