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Sing-Mo Tzeng
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Austin, TX, US
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last 30 patents
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Patent Grant
Method for forming air gaps for advanced interconnect systems
Patent number
6,037,249
Issue date
Mar 14, 2000
Intel Corporation
Chien Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect structure and method to achieve unlanded vias for low...
Patent number
5,935,868
Issue date
Aug 10, 1999
Intel Corporation
Sychyi Fang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of using additives with silica-based slurries to enhance sel...
Patent number
5,614,444
Issue date
Mar 25, 1997
Sematech, Inc.
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS