SinJae Lee

Person

Kyoungki-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 9,401,347
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 9,379,064
- Issue date Jun 28, 2016
- STATS ChipPAC Pte. Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 9,048,209
- Issue date Jun 2, 2015
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,937,371
- Issue date Jan 20, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming Fo-WLCSP having conducti...
- Patent number 8,836,114
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with shielding spacer and metho...
- Patent number 8,569,870
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a shielding layer over a...
- Patent number 8,531,012
- Issue date Sep 10, 2013
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming Fo-WLCSP having conducti...
- Patent number 8,343,810
- Issue date Jan 1, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of mounting semiconductor die to he...
- Patent number 8,003,496
- Issue date Aug 23, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system
- Patent number 8,004,093
- Issue date Aug 23, 2011
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with heat spreader
- Patent number 7,683,469
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20150228590
- Publication date Aug 13, 2015
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer Over a...
- Publication number 20150137334
- Publication date May 21, 2015
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20130292804
- Publication date Nov 7, 2013
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20130075919
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...
- Publication number 20120038053
- Publication date Feb 16, 2012
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20110278705
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Shielding Layer over a...
- Publication number 20110095403
- Publication date Apr 28, 2011
- STATS ChipPAC, Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Mounting Semiconductor Die to He...
- Publication number 20110037165
- Publication date Feb 17, 2011
- STATS ChipPAC, Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
- Publication number 20100025835
- Publication date Feb 4, 2010
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
- Publication number 20090294941
- Publication date Dec 3, 2009
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of mounting semiconductor die to he...

Semiconductor device and method of mounting semiconductor die to he...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of forming Fo-WLCSP having conducti...

Integrated circuit packaging system with shielding spacer and metho...

Semiconductor device and method of forming a shielding layer over a...

Semiconductor device and method of forming Fo-WLCSP having conducti...

Semiconductor device and method of mounting semiconductor die to he...

Integrated circuit package stacking system

Package-on-package system with heat spreader

Patents Applicationslast 30 patents

Semiconductor Device and Method of Mounting Semiconductor Die to He...

Semiconductor Device and Method of Forming a Shielding Layer Over a...

Semiconductor Device and Method of Forming a Shielding Layer over a...

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

Semiconductor Device and Method of Forming FO-WLCSP Having Conducti...

Semiconductor Device and Method of Mounting Semiconductor Die to He...

Semiconductor Device and Method of Forming a Shielding Layer over a...

Semiconductor Device and Method of Mounting Semiconductor Die to He...

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM

PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER