Siow Chek Tan

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Los Gatos, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus of package enabled ESD protection
- Patent number 11,043,484
- Issue date Jun 22, 2021
- Xilinx, Inc.
- Hong Shi
- G01 - MEASURING TESTING
Information Patent Grant
Chip scale package (CSP) including shim die
- Patent number 10,770,364
- Issue date Sep 8, 2020
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low crosstalk vertical connection interface
- Patent number 10,314,163
- Issue date Jun 4, 2019
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-ground co-reference transceiver structure to deliver ultra-lo...
- Patent number 10,057,976
- Issue date Aug 21, 2018
- Xilinx, Inc.
- Hong Shi
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE
- Publication number 20190318975
- Publication date Oct 17, 2019
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CROSSTALK VERTICAL CONNECTION INTERFACE
- Publication number 20180338375
- Publication date Nov 22, 2018
- Xilinx, Inc.
- Hong Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR