Siping Hu

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads of three-dimensional memory device and fabrication met...
- Patent number 12,133,386
- Issue date Oct 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yongqing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device comprising contact pads exposed by...
- Patent number 12,089,406
- Issue date Sep 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yongqing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stress control using backside film deposition and laser anneal
- Patent number 11,842,911
- Issue date Dec 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices having bonding layers
- Patent number 11,450,653
- Issue date Sep 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods for forming the...
- Patent number 11,233,041
- Issue date Jan 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods for forming the...
- Patent number 11,037,945
- Issue date Jun 15, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation process of image sensors
- Patent number 9,455,297
- Issue date Sep 27, 2016
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...
- Publication number 20250008735
- Publication date Jan 2, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yongqing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND MANUFACTURING METHODS THEREOF...
- Publication number 20230422528
- Publication date Dec 28, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE
- Publication number 20230092768
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Lan YAO
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL INTEGRATION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230065535
- Publication date Mar 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING
- Publication number 20230062030
- Publication date Mar 2, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
- Publication number 20230062866
- Publication date Mar 2, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230005873
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20220246544
- Publication date Aug 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20220238479
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...
- Publication number 20220181351
- Publication date Jun 9, 2022
- Yangtze Memory Technologies Co., Ltd.
- Yongqing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...
- Publication number 20220181350
- Publication date Jun 9, 2022
- Yangtze Memory Technologies Co., Ltd.
- Yongqing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20220068905
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210398932
- Publication date Dec 23, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210335745
- Publication date Oct 28, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20210210459
- Publication date Jul 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134778
- Publication date May 6, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134820
- Publication date May 6, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Shiqi Huang
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134779
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200006275
- Publication date Jan 2, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200006284
- Publication date Jan 2, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING AN EMBEDDED COLOR FILTER AND ITS PREPARATION ME...
- Publication number 20160093661
- Publication date Mar 31, 2016
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION PROCESS OF IMAGE SENSORS
- Publication number 20160093663
- Publication date Mar 31, 2016
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Three-dimensional memory devices and fabricating methods thereof

Contact pads of three-dimensional memory device and fabrication met...

Three-dimensional memory device comprising contact pads exposed by...

Method for forming a three-dimensional (3D) memory device having bo...

Metal-dielectric bonding method and structure

Wafer stress control using backside film deposition and laser anneal

Metal-dielectric bonding method and structure

Metal-dielectric bonding method and structure

Bonded three-dimensional memory devices having bonding layers

Bonded three-dimensional memory devices and methods for forming the...

Bonded three-dimensional memory devices and methods for forming the...

Preparation process of image sensors

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...

THREE-DIMENSIONAL MEMORY DEVICES AND MANUFACTURING METHODS THEREOF...

3D MEMORY DEVICE

THREE-DIMENSIONAL INTEGRATION STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH SEAL RING

WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...

CONTACT PADS OF THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION MET...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

IMAGE SENSOR HAVING AN EMBEDDED COLOR FILTER AND ITS PREPARATION ME...

PREPARATION PROCESS OF IMAGE SENSORS