Siriluck Wongratanaporngoorn

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Bangkok, TH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer dicing method
- Patent number 10,297,500
- Issue date May 21, 2019
- Nexperia B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE SEPARATION USING ADHESIVE-LAYER LASER SCRIBING
- Publication number 20190164784
- Publication date May 30, 2019
- NXP B.V.
- Siriluck Wongratanaporngoorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DICING METHOD
- Publication number 20180174907
- Publication date Jun 21, 2018
- Nexperia B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS