Siriwanna Ounkaew

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Lop-Buri, TH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with plated metal shielding and a method thereof
- Patent number 10,600,741
- Issue date Mar 24, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Suebphong Yenrudee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plated metal shielding and a method thereof
- Patent number 10,242,953
- Issue date Mar 26, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Suebphong Yenrudee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Disposing Electrical Components...
- Publication number 20220320033
- Publication date Oct 6, 2022
- UTAC Headquarters Pte. Ltd.
- Krit Pajuvang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210202339
- Publication date Jul 1, 2021
- UTAC Headquarters Pte. Ltd.
- Surachai Uraisakul
- H01 - BASIC ELECTRIC ELEMENTS