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last 30 patents
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Patent Grant
Air gap type semiconductor device package structure
Patent number
11,979,136
Issue date
May 7, 2024
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Yunxiang Di
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air gap type semiconductor device package structure and fabrication...
Patent number
11,695,387
Issue date
Jul 4, 2023
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
Yunxiang Di
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE
Publication number
20230291379
Publication date
Sep 14, 2023
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Yunxiang DI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR GAP TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND FABRICATION...
Publication number
20200366267
Publication date
Nov 19, 2020
Ningbo Semiconductor International Corporation (Shanghai Branch)
Yunxiang DI
H01 - BASIC ELECTRIC ELEMENTS