Siu Wing Lau

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding process incorporating infrared vision system
- Patent number 8,633,441
- Issue date Jan 21, 2014
- ASM Assembly Automation LTD
- Ran Shi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table for die bonding apparatus
- Patent number 6,543,513
- Issue date Apr 8, 2003
- ASM Assembly Automation Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING PROCESS INCORPORATING INFRARED VISION SYSTEM
- Publication number 20110051124
- Publication date Mar 3, 2011
- Ran Shi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for indexing and severing film
- Publication number 20050034577
- Publication date Feb 17, 2005
- ASM Assembly Automation Ltd
- Yuk Cheung Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-pin epoxy writing apparatus
- Publication number 20030044534
- Publication date Mar 6, 2003
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS