SIVA PRAKASH GURRUM

Person

ALLEN, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 12,159,808
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,869,820
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multichip module with conductive connectors
- Patent number 11,538,742
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 11,521,904
- Issue date Dec 6, 2022
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 11,430,719
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Manu A. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,387,155
- Issue date Jul 12, 2022
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with filler particles in a mold compound
- Patent number 11,139,178
- Issue date Oct 5, 2021
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a wire bond mesh
- Patent number 11,121,049
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multichip module with conductive connectors
- Patent number 10,622,290
- Issue date Apr 14, 2020
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot-solderable leads for semiconductor device packages
- Patent number 10,607,927
- Issue date Mar 31, 2020
- Texas Instruments Incorporated
- Manu J. Prakuzhy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned die pad for packaged vertical semiconductor devices
- Patent number 10,497,643
- Issue date Dec 3, 2019
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with filler particles in a mold compound
- Patent number 10,446,414
- Issue date Oct 15, 2019
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package with a wire bond mesh
- Patent number 10,204,842
- Issue date Feb 12, 2019
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,165,873
- Issue date Oct 20, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-time based peak current density rule and design method
- Patent number 9,157,938
- Issue date Oct 13, 2015
- Texas Instruments Incorporated
- Young-Joon Park
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,142,496
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial four-point probe for low resistance measurements
- Patent number 9,030,216
- Issue date May 12, 2015
- Texas Instruments Incorporated
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Grant
Method for contacting agglomerate terminals of semiconductor packages
- Patent number 8,716,068
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having agglomerate terminals
- Patent number 8,643,165
- Issue date Feb 4, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 8,304,897
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial four-point probe for low resistance measurements
- Patent number 8,174,276
- Issue date May 8, 2012
- Texas Instruments Incorporated
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 8,129,224
- Issue date Mar 6, 2012
- Texas Instruments Incorporated
- Siva P Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction from packaged semiconductor chips, scalable with ch...
- Patent number 7,989,949
- Issue date Aug 2, 2011
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material design for enhanced thermal performance...
- Patent number 7,956,456
- Issue date Jun 7, 2011
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 7,838,988
- Issue date Nov 23, 2010
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction from packaged semiconductor chips, scalable with ch...
- Patent number 7,572,679
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND DAMAGE DETECTOR INCLUDING A DETECTION BOND PAD OVER A FIR...
- Publication number 20230100709
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
- Publication number 20220336304
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND DAMAGE DETECTOR
- Publication number 20210287950
- Publication date Sep 16, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
- Publication number 20210183717
- Publication date Jun 17, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS
- Publication number 20200243428
- Publication date Jul 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND
- Publication number 20200043753
- Publication date Feb 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar NANGIA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS
- Publication number 20200020620
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED DIE PAD FOR PACKAGED VERTICAL SEMICONDUCTOR DEVICES
- Publication number 20190348346
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- SIVA PRAKASH GURRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20190318983
- Publication date Oct 17, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Manu A. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND
- Publication number 20190198352
- Publication date Jun 27, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar NANGIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
- Publication number 20190172766
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH
- Publication number 20180233422
- Publication date Aug 16, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot-Solderable Leads for Semiconductor Device Packages
- Publication number 20180076116
- Publication date Mar 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Manu J. Prakuzhy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-TIME BASED PEAK CURRENT DENSITY RULE AND DESIGN METHOD
- Publication number 20140129166
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- YOUNG-JOON PARK
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20140038358
- Publication date Feb 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20120211889
- Publication date Aug 23, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coaxial Four-Point Probe for Low Resistance Measurements
- Publication number 20120194208
- Publication date Aug 2, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Application
Thermal Interface Material Design for Enhanced Thermal Performance...
- Publication number 20110204506
- Publication date Aug 25, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stud Bumps as Local Heat Sinks During Transient Power Operations
- Publication number 20110027943
- Publication date Feb 3, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash GURRUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS
- Publication number 20100301470
- Publication date Dec 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Siva P. Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL FOUR-POINT PROBE FOR LOW RESISTANCE MEASUREMENTS
- Publication number 20090289648
- Publication date Nov 26, 2009
- Michael Anthony Lamson
- G01 - MEASURING TESTING
Information Patent Application
Heat Extraction from Packaged Semiconductor Chips, Scalable with Ch...
- Publication number 20090267218
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Vikas GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE...
- Publication number 20090212418
- Publication date Aug 27, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Siva Prakash Gurrum
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heat Extraction from Packaged Semiconductor Chips, Scalable with Ch...
- Publication number 20090026605
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS

SIVA PRAKASH GURRUM

Person

Patents Grantslast 30 patents

Wire bond damage detector including a detection bond pad over a fir...

IC having a metal ring thereon for stress reduction

Packaged multichip module with conductive connectors

Wire bond damage detector including a detection bond pad over a fir...

Spot-solderable leads for semiconductor device packages

IC having a metal ring thereon for stress reduction

Semiconductor package with filler particles in a mold compound

Semiconductor package with a wire bond mesh

Packaged multichip module with conductive connectors

Spot-solderable leads for semiconductor device packages

Patterned die pad for packaged vertical semiconductor devices

Semiconductor package with filler particles in a mold compound

Semiconductor package with a wire bond mesh

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

On-time based peak current density rule and design method

Semiconductor package having etched foil capacitor integrated into...

Coaxial four-point probe for low resistance measurements

Method for contacting agglomerate terminals of semiconductor packages

Semiconductor device having agglomerate terminals

Thermal interface material design for enhanced thermal performance...

Coaxial four-point probe for low resistance measurements

Stud bumps as local heat sinks during transient power operations

Heat extraction from packaged semiconductor chips, scalable with ch...

Thermal interface material design for enhanced thermal performance...

Stud bumps as local heat sinks during transient power operations

Heat extraction from packaged semiconductor chips, scalable with ch...

Patents Applicationslast 30 patents

WIRE BOND DAMAGE DETECTOR INCLUDING A DETECTION BOND PAD OVER A FIR...

IC HAVING A METAL RING THEREON FOR STRESS REDUCTION

WIREBOND DAMAGE DETECTOR

IC HAVING A METAL RING THEREON FOR STRESS REDUCTION

PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS

SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND

PACKAGED MULTICHIP MODULE WITH CONDUCTIVE CONNECTORS

PATTERNED DIE PAD FOR PACKAGED VERTICAL SEMICONDUCTOR DEVICES

Spot-Solderable Leads for Semiconductor Device Packages

SEMICONDUCTOR PACKAGE WITH FILLER PARTICLES IN A MOLD COMPOUND

SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH

SEMICONDUCTOR PACKAGE WITH A WIRE BOND MESH

Spot-Solderable Leads for Semiconductor Device Packages

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

ON-TIME BASED PEAK CURRENT DENSITY RULE AND DESIGN METHOD

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

Coaxial Four-Point Probe for Low Resistance Measurements

Thermal Interface Material Design for Enhanced Thermal Performance...

Stud Bumps as Local Heat Sinks During Transient Power Operations

STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS

COAXIAL FOUR-POINT PROBE FOR LOW RESISTANCE MEASUREMENTS

Heat Extraction from Packaged Semiconductor Chips, Scalable with Ch...

THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE...

Heat Extraction from Packaged Semiconductor Chips, Scalable with Ch...