SivaChandra Jangam

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Seal ring designs supporting efficient die to die routing
- Patent number 11,862,481
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 11,824,015
- Issue date Nov 21, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240103238
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- G02 - OPTICS
Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240105699
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20240096648
- Publication date Mar 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20240038689
- Publication date Feb 1, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20230040308
- Publication date Feb 9, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20220293433
- Publication date Sep 15, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

SivaChandra Jangam

Person

Patents Grantslast 30 patents

Seal ring designs supporting efficient die to die routing

Structure and method for sealing a silicon IC

Patents Applicationslast 30 patents

3D System and Wafer Reconstitution with Mid-layer Interposer

Semiconductor Package with Local Interconnect and Chiplet Integration

3D System and Wafer Reconstitution with Mid-layer Interposer

Seal Ring Designs Supporting Efficient Die to Die Routing

Structure and Method for Sealing a Silicon IC

Structure and Method for Sealing a Silicon IC

Seal Ring Designs Supporting Efficient Die to Die Routing