Slawomir Skocki

Person

  • Turin, IT

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Contact pad structure for flip chip semiconductor die

    • Publication number 20070096316
    • Publication date May 3, 2007
    • International Rectifier Corporation
    • Hazel D. Schofield
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-scale schottky device

    • Publication number 20070034984
    • Publication date Feb 15, 2007
    • International Rectifier Corporation
    • Slawomir Skocki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip-scale schottky device

    • Publication number 20040084770
    • Publication date May 6, 2004
    • International Rectifier Corporation
    • Slawomir Skocki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Termination for high voltage Schottky diode

    • Publication number 20020190338
    • Publication date Dec 19, 2002
    • International Rectifier Corp.
    • Slawomir Skocki
    • H01 - BASIC ELECTRIC ELEMENTS