Sock Chien Tey

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods for manufacturing thereof
- Patent number 12,300,559
- Issue date May 13, 2025
- Infineon Technologies AG
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad package with conductive clips connected to terminals at upper...
- Patent number 11,217,511
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including roughening features
- Patent number 10,937,744
- Issue date Mar 2, 2021
- Infineon Technologies AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Package with Conductive Clips Connected to Terminals at Upper...
- Publication number 20200328140
- Publication date Oct 15, 2020
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ROUGHENING FEATURES
- Publication number 20200273813
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Wern Ken Daryl Wee
- H01 - BASIC ELECTRIC ELEMENTS