Soenke Habenicht

Person

Hamburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,508,844
- Issue date Nov 22, 2022
- Nexperia B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method of manufacture
- Patent number 10,720,498
- Issue date Jul 21, 2020
- Nexperia B.V.
- Martin Roever
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer contact and method of manufact...
- Patent number 9,466,688
- Issue date Oct 11, 2016
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package and method
- Patent number 9,443,791
- Issue date Sep 13, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with multiple I/O side-solderable terminals
- Patent number 9,425,130
- Issue date Aug 23, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer contact and method of manufact...
- Patent number 9,331,186
- Issue date May 3, 2016
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for an electronic circuit substrate and electroni...
- Patent number 8,809,695
- Issue date Aug 19, 2014
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with grounding structure
- Patent number 8,062,974
- Issue date Nov 22, 2011
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20190165111
- Publication date May 30, 2019
- NEXPERIA B.V.
- Martin ROEVER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170092761
- Publication date Mar 30, 2017
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTILAYER CONTACT AND METHOD OF MANUFACT...
- Publication number 20160218193
- Publication date Jul 28, 2016
- NXP B.V.
- Soenke HABENICHT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS
- Publication number 20160126162
- Publication date May 5, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20160035651
- Publication date Feb 4, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTILAYER CONTACT AND METHOD OF MANUFACT...
- Publication number 20120248575
- Publication date Oct 4, 2012
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR AN ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONI...
- Publication number 20100244275
- Publication date Sep 30, 2010
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device With Stress Relief Element
- Publication number 20080251907
- Publication date Oct 16, 2008
- Koninklijke Philips Electronics N.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Grounding Structure
- Publication number 20080217785
- Publication date Sep 11, 2008
- NXP B.V.
- Soenke Habenicht
- H01 - BASIC ELECTRIC ELEMENTS

Soenke Habenicht

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device structure and method of manufacture

Semiconductor device with multilayer contact and method of manufact...

Leadless semiconductor package and method

Package with multiple I/O side-solderable terminals

Semiconductor device with multilayer contact and method of manufact...

Contact structure for an electronic circuit substrate and electroni...

Semiconductor device with grounding structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH MULTILAYER CONTACT AND METHOD OF MANUFACT...

PACKAGE WITH MULTIPLE I/O SIDE-SOLDERABLE TERMINALS

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR DEVICE WITH MULTILAYER CONTACT AND METHOD OF MANUFACT...

CONTACT STRUCTURE FOR AN ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONI...

Electronic Device With Stress Relief Element

Semiconductor Device with Grounding Structure