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Sohei Tanaka
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Neyagawa, JP
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last 30 patents
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Patent Grant
Component mounting apparatus
Patent number
4,473,247
Issue date
Sep 25, 1984
Matsushita Electric Industrial Co., Ltd.
Eiji Itemadani
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Patent Grant
Assembly devices for electronic circuit components
Patent number
4,411,362
Issue date
Oct 25, 1983
Matsushita Electric Industrial Co., Ltd.
Eiji Itemadani
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL