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Sohichi Kadoguchi
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Beppu Oita, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Spot heat wirebonding
Patent number
7,926,698
Issue date
Apr 19, 2011
Texas Instruments Incorporated
Norihiro Kawakami
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Spot heat wirebonding
Patent number
7,677,432
Issue date
Mar 16, 2010
Texas Instruments Incorporated
Norihiro Kawakami
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonds having pressure-absorbing balls
Patent number
7,404,513
Issue date
Jul 29, 2008
Texas Instruments Incorporated
Sohichi Kadoguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor packages and methods for manufacturing such semicondu...
Patent number
6,768,212
Issue date
Jul 27, 2004
Texas Instruments Incorporated
Akira Karashima
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Spot Heat Wirebonding
Publication number
20100140327
Publication date
Jun 10, 2010
TEXAS INSTRUMENTS INCORPORATED
Norihiro KAWAKAMI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire Bonds Having Pressure-Absorbing Balls
Publication number
20080251918
Publication date
Oct 16, 2008
TEXAS INSTRUMENTS INCORPORATED
SOHICHI KADOGUCHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip-Chip Device Having Underfill in Controlled Gap
Publication number
20070200234
Publication date
Aug 30, 2007
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Spot heat wirebonding
Publication number
20060249561
Publication date
Nov 9, 2006
Norihiro Kawakami
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wire bonds having pressure-absorbing balls
Publication number
20060144907
Publication date
Jul 6, 2006
Sohichi Kadoguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor packages and methods for manufacturing such semicondu...
Publication number
20030137033
Publication date
Jul 24, 2003
Akira Karashima
H01 - BASIC ELECTRIC ELEMENTS