Sohichi Kadoguchi

Person

  • Beppu Oita, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Spot heat wirebonding

    • Patent number 7,926,698
    • Issue date Apr 19, 2011
    • Texas Instruments Incorporated
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Spot heat wirebonding

    • Patent number 7,677,432
    • Issue date Mar 16, 2010
    • Texas Instruments Incorporated
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonds having pressure-absorbing balls

    • Patent number 7,404,513
    • Issue date Jul 29, 2008
    • Texas Instruments Incorporated
    • Sohichi Kadoguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor packages and methods for manufacturing such semicondu...

    • Patent number 6,768,212
    • Issue date Jul 27, 2004
    • Texas Instruments Incorporated
    • Akira Karashima
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Spot Heat Wirebonding

    • Publication number 20100140327
    • Publication date Jun 10, 2010
    • TEXAS INSTRUMENTS INCORPORATED
    • Norihiro KAWAKAMI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire Bonds Having Pressure-Absorbing Balls

    • Publication number 20080251918
    • Publication date Oct 16, 2008
    • TEXAS INSTRUMENTS INCORPORATED
    • SOHICHI KADOGUCHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flip-Chip Device Having Underfill in Controlled Gap

    • Publication number 20070200234
    • Publication date Aug 30, 2007
    • TEXAS INSTRUMENTS INCORPORATED
    • Mark A. Gerber
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Spot heat wirebonding

    • Publication number 20060249561
    • Publication date Nov 9, 2006
    • Norihiro Kawakami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonds having pressure-absorbing balls

    • Publication number 20060144907
    • Publication date Jul 6, 2006
    • Sohichi Kadoguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor packages and methods for manufacturing such semicondu...

    • Publication number 20030137033
    • Publication date Jul 24, 2003
    • Akira Karashima
    • H01 - BASIC ELECTRIC ELEMENTS