Sohji Sakata

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure of thermal conductive members for a multi-chip mo...
- Patent number 5,276,586
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Toshio Hatsuda
- H01 - BASIC ELECTRIC ELEMENTS