Sohrab Safai

Follow

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bond pad having a trench and method for forming
- Patent number 9,515,034
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sohrab Safai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad and passivation layer having a gap and method for forming
- Patent number 9,111,755
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having wire bonds and method therefor
- Patent number 7,015,585
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die semiconductor package
- Patent number 6,879,028
- Issue date Apr 12, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-on-chip semiconductor device and method for its fabrication
- Patent number 5,572,066
- Issue date Nov 5, 1996
- Motorola Inc.
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194396
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194395
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-die semiconductor package
- Publication number 20040164382
- Publication date Aug 26, 2004
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit having wire bonds and method therefor
- Publication number 20040119168
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS