Soichi Honma

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Yamato, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,959,363
- Issue date Sep 28, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,864,178
- Issue date Jan 26, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS