Soichi Nadahara

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate treating apparatus and substrate treating method
- Patent number 10,153,181
- Issue date Dec 11, 2018
- SCREEN Holdings Co., Ltd.
- Yuta Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus and substrate treatment method
- Patent number 7,913,346
- Issue date Mar 29, 2011
- Dainippon Screen Mfg. Co., Ltd.
- Masaki Iwami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching apparatus, a method of controlling an etching solution, and...
- Patent number 7,776,756
- Issue date Aug 17, 2010
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,700,381
- Issue date Apr 20, 2010
- Kabushikia Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material supply system in semiconductor device manufacturing plant
- Patent number 7,305,275
- Issue date Dec 4, 2007
- Ebara Corporation
- Kunihiro Miyazaki
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Etching apparatus, a method of controlling an etching solution, and...
- Patent number 7,267,742
- Issue date Sep 11, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and a method for manufacturing a semiconductor...
- Patent number 7,268,053
- Issue date Sep 11, 2007
- Kabushiki Kaisha Toshiba
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and a method for manufacturing a semiconductor...
- Patent number 7,253,500
- Issue date Aug 7, 2007
- Kabushiki Kaisha Toshiba
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and apparatus
- Patent number 7,101,259
- Issue date Sep 5, 2006
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,057,259
- Issue date Jun 6, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding unit, processing apparatus and holding method of substrates
- Patent number 7,055,535
- Issue date Jun 6, 2006
- Ebara Corporation
- Junji Kunisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and a method for manufacturing a semiconductor...
- Patent number 7,015,566
- Issue date Mar 21, 2006
- Kabushiki Kaisha Toshiba
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method and cleaner
- Patent number 6,679,950
- Issue date Jan 20, 2004
- Ebara Corporation
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Grant
Apparatus and method for cleaning a semiconductor substrate
- Patent number 6,673,163
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Grant
Polishing method and apparatus
- Patent number 6,667,238
- Issue date Dec 23, 2003
- Ebara Corporation
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Etching for manufacture of semiconductor devices
- Patent number 6,645,876
- Issue date Nov 11, 2003
- Kabushiki Kaisha Toshiba
- Mami Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in trench
- Patent number 6,639,317
- Issue date Oct 28, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cleaning semiconductor substrate
- Patent number 6,543,080
- Issue date Apr 8, 2003
- Ebara Corporation
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,492,271
- Issue date Dec 10, 2002
- Kabushiki Kaisha Toshiba
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus method for manufacturing semic...
- Patent number 6,436,723
- Issue date Aug 20, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for cleaning a semiconductor substrate
- Patent number 6,431,185
- Issue date Aug 13, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Grant
Method of manufacturing a semiconductor device including a seamless...
- Patent number 6,333,274
- Issue date Dec 25, 2001
- Kabushiki Kaisha Toshiba
- Hiroyuki Akatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer drying apparatus and method with residual particle removabili...
- Patent number 6,286,524
- Issue date Sep 11, 2001
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of trench capacitors using disposable hard mask
- Patent number 6,190,955
- Issue date Feb 20, 2001
- International Business Machines Corporation
- Matthias Ilg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid displacement apparatus and liquid displacement method
- Patent number 6,159,303
- Issue date Dec 12, 2000
- Kabushiki Kaisha Toshiba
- Soichi Nadahara
- B08 - CLEANING
Information Patent Grant
Process for cleaning the interior of semiconductor substrate
- Patent number 6,059,887
- Issue date May 9, 2000
- Purex Co., Ltd.
- Hisashi Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning system with progressive megasonic wave
- Patent number 6,021,789
- Issue date Feb 8, 2000
- International Business Machines Corporation
- Hiroyuki Akatsu
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,989,988
- Issue date Nov 23, 1999
- Kabushiki Kaisha Toshiba
- Toshihiko Iinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor drying system and method
- Patent number 5,815,942
- Issue date Oct 6, 1998
- Kabushiki Kaisha Toshiba
- Jin Jwang Wu
- F26 - DRYING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,360,748
- Issue date Nov 1, 1994
- Kabushiki Kaisha Toshiba
- Soichi Nadahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
- Publication number 20170345683
- Publication date Nov 30, 2017
- SCREEN Holdings Co., Ltd.
- Yuta SASAKI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
ETCHING APPARATUS, A METHOD OF CONTROLLING AN ETCHING SOLUTION, AND...
- Publication number 20100210110
- Publication date Aug 19, 2010
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20080083501
- Publication date Apr 10, 2008
- Kenichiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate treatment apparatus and substrate treatment method
- Publication number 20060219260
- Publication date Oct 5, 2006
- Dainippon Screen Mfg. Co., Ltd.
- Masaki Iwami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20060131696
- Publication date Jun 22, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and a method for manufacturing a semiconductor...
- Publication number 20060118916
- Publication date Jun 8, 2006
- Kabushiki Kaisha Toshiba
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching apparatus, a method of controlling an etching solution, and...
- Publication number 20050230045
- Publication date Oct 20, 2005
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material supply system in semiconductor device manufacturing plant
- Publication number 20050177273
- Publication date Aug 11, 2005
- EBARA CORPORATION
- Kunihiro Miyazaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor wafer and a method for manufacturing a semiconductor...
- Publication number 20050167857
- Publication date Aug 4, 2005
- Kabushiki Kaisha Toshiba
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate treating apparatus
- Publication number 20040221880
- Publication date Nov 11, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Application
Semiconductor wafer and a methd for manufacturing a semiconductor w...
- Publication number 20040129940
- Publication date Jul 8, 2004
- Masao Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing method and apparatus
- Publication number 20040087258
- Publication date May 6, 2004
- Norio Kimura
- B24 - GRINDING POLISHING
Information Patent Application
Holding unit, processing apparatus and holding method of substrates
- Publication number 20040016452
- Publication date Jan 29, 2004
- Junji Kunisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20030003608
- Publication date Jan 2, 2003
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for cleaning a semiconductor substrate
- Publication number 20020170572
- Publication date Nov 21, 2002
- KABUSHIKI KAISHA TOSHIBA
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method and etching apparatus, method for manufacturing semi...
- Publication number 20020164887
- Publication date Nov 7, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching for manufacture of semiconductor devices
- Publication number 20020086552
- Publication date Jul 4, 2002
- Mami Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Holding unit, processing apparatus and holding method of substrates
- Publication number 20020050322
- Publication date May 2, 2002
- Junji Kunisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning method and cleaner
- Publication number 20020005214
- Publication date Jan 17, 2002
- Hiroshi Tomita
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Semiconductor device having multilevel interconnection
- Publication number 20020003304
- Publication date Jan 10, 2002
- Kabushiki Kaisha Toshiba
- Noriaki Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A SEAMLESS...
- Publication number 20010023134
- Publication date Sep 20, 2001
- HIROYUKI AKATSU
- H01 - BASIC ELECTRIC ELEMENTS

Soichi Nadahara

Person

Patents Grantslast 30 patents

Substrate treating apparatus and substrate treating method

Substrate treatment apparatus and substrate treatment method

Etching apparatus, a method of controlling an etching solution, and...

Semiconductor wafer with ID mark, equipment for and method of manuf...

Material supply system in semiconductor device manufacturing plant

Etching apparatus, a method of controlling an etching solution, and...

Semiconductor wafer and a method for manufacturing a semiconductor...

Semiconductor wafer and a method for manufacturing a semiconductor...

Polishing method and apparatus

Semiconductor wafer with ID mark, equipment for and method of manuf...

Holding unit, processing apparatus and holding method of substrates

Semiconductor wafer and a method for manufacturing a semiconductor...

Cleaning method and cleaner

Apparatus and method for cleaning a semiconductor substrate

Polishing method and apparatus

Etching for manufacture of semiconductor devices

Semiconductor device in trench

Apparatus and method for cleaning semiconductor substrate

Semiconductor device and method of manufacturing the same

Etching method and etching apparatus method for manufacturing semic...

Apparatus and method for cleaning a semiconductor substrate

Method of manufacturing a semiconductor device including a seamless...

Wafer drying apparatus and method with residual particle removabili...

Fabrication of trench capacitors using disposable hard mask

Liquid displacement apparatus and liquid displacement method

Process for cleaning the interior of semiconductor substrate

Wafer cleaning system with progressive megasonic wave

Semiconductor device and method of manufacturing the same

Vapor drying system and method

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

ETCHING APPARATUS, A METHOD OF CONTROLLING AN ETCHING SOLUTION, AND...

SUBSTRATE PROCESSING APPARATUS

Substrate treatment apparatus and substrate treatment method

Semiconductor wafer with ID mark, equipment for and method of manuf...

Semiconductor wafer and a method for manufacturing a semiconductor...

Etching apparatus, a method of controlling an etching solution, and...

Material supply system in semiconductor device manufacturing plant

Semiconductor wafer and a method for manufacturing a semiconductor...

Substrate treating apparatus

Semiconductor wafer and a methd for manufacturing a semiconductor w...

Polishing method and apparatus

Holding unit, processing apparatus and holding method of substrates

Semiconductor wafer with ID mark, equipment for and method of manuf...

Apparatus and method for cleaning a semiconductor substrate

Etching method and etching apparatus, method for manufacturing semi...

Etching for manufacture of semiconductor devices

Holding unit, processing apparatus and holding method of substrates

Cleaning method and cleaner

Semiconductor device having multilevel interconnection

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A SEAMLESS...