Soichiro Kishimoto

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,520,053
- Issue date Apr 21, 2009
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible wiring boards for double-side connection
- Patent number 7,285,727
- Issue date Oct 23, 2007
- Sony Corporation
- Soichiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,020,961
- Issue date Apr 4, 2006
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring board
- Patent number 6,941,648
- Issue date Sep 13, 2005
- Sony Corporation
- Kazuhiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer flexible wiring boards
- Patent number 6,653,736
- Issue date Nov 25, 2003
- Sony Chemicals Corporation
- Soichiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 6,570,098
- Issue date May 27, 2003
- Sony Corporation
- Kazuhiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating multilayer flexible wiring boards
- Patent number 6,524,892
- Issue date Feb 25, 2003
- Sony Chemicals Corp.
- Soichiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-attached wiring circuit board and method for manufacturing same
- Patent number 6,518,510
- Issue date Feb 11, 2003
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a bump-attached wiring circuit board
- Publication number 20060070978
- Publication date Apr 6, 2006
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible wiring boards for double-side connection
- Publication number 20030136578
- Publication date Jul 24, 2003
- Sony Chemicals Corp.
- Soichiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method for producing the same
- Publication number 20030116345
- Publication date Jun 26, 2003
- Kazuhiro Shimzu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer flexible wiring boards
- Publication number 20030089984
- Publication date May 15, 2003
- Sony Chemicals Corp.
- Soichiro Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20030034173
- Publication date Feb 20, 2003
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20020005292
- Publication date Jan 17, 2002
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board and method for producing the same
- Publication number 20010040794
- Publication date Nov 15, 2001
- Kazuhiro Shimizu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Soichiro Kishimoto

Person

Patents Grantslast 30 patents

Method for manufacturing a bump-attached wiring circuit board

Flexible wiring boards for double-side connection

Method for manufacturing a bump-attached wiring circuit board

Method for producing printed wiring board

Multilayer flexible wiring boards

Printed wiring board and method for producing the same

Method of fabricating multilayer flexible wiring boards

Bump-attached wiring circuit board and method for manufacturing same

Patents Applicationslast 30 patents

Method for manufacturing a bump-attached wiring circuit board

Flexible wiring boards for double-side connection

Printed wiring board and method for producing the same

Multilayer flexible wiring boards

Bump-attached wiring circuit board and method for manufacturing same

Bump-attached wiring circuit board and method for manufacturing same

Printed wiring board and method for producing the same