Som S. Swamy

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Danville, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating flexible circuit structures
- Patent number 6,391,220
- Issue date May 21, 2002
- Fujitsu Limited, Inc.
- Lei Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Controlled impedance interposer substrate and method of making
- Patent number 6,102,710
- Issue date Aug 15, 2000
- Fujitsu Limited
- Solomon I. Beilin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled impedence interposer substrate
- Patent number 5,854,534
- Issue date Dec 29, 1998
- Fujitsu Limited
- Solomon I. Beilin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multichip module substrate
- Patent number 5,778,529
- Issue date Jul 14, 1998
- Fujitsu Limited
- Solomon I. Beilin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module substrate
- Patent number 5,544,017
- Issue date Aug 6, 1996
- Fujitsu Limited
- Solomon I. Beilin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating thin-film interconnector
- Patent number 5,419,038
- Issue date May 30, 1995
- Fujitsu Limited
- Wen-chou V. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR