TREA

Sombat Chanvilai

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of dividing wafer
    • Patent number 9,653,366
    • Issue date May 16, 2017
    • Disco Corporation
    • Satoshi Miyata
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF DIVIDING WAFER
    • Publication number 20160293501
    • Publication date Oct 6, 2016
    • Disco Corporation
    • Satoshi Miyata
    • H01 - BASIC ELECTRIC ELEMENTS