Somilkumar J. Rathi

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conformal titanium nitride-based thin films and methods of forming...
- Patent number 12,165,918
- Issue date Dec 10, 2024
- Eugenus, Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative monetization of precursor in process development of non-l...
- Patent number 12,147,941
- Issue date Nov 19, 2024
- Kepler Computing Inc.
- Sasikanth Manipatruni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rapid thermal annealing (RTA) methodologies for integration of pero...
- Patent number 12,094,923
- Issue date Sep 17, 2024
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative method of multilayer stack development for device applica...
- Patent number 12,062,584
- Issue date Aug 13, 2024
- Kepler Computing Inc.
- Sasikanth Manipatruni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitors with continuous dielectric layer and methods of f...
- Patent number 12,034,086
- Issue date Jul 9, 2024
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar and trench capacitors with hydrogen barrier dielectric for l...
- Patent number 12,029,043
- Issue date Jul 2, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
Information Patent Grant
Planar and trench capacitors for logic and memory applications and...
- Patent number 12,022,662
- Issue date Jun 25, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
Information Patent Grant
Planar and trench capacitors for logic and memory applications
- Patent number 12,016,185
- Issue date Jun 18, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
Information Patent Grant
Multi-level hydrogen barrier layers for memory applications and met...
- Patent number 12,010,854
- Issue date Jun 11, 2024
- Kepler Computing Inc.
- Noriyuki Sato
Information Patent Grant
Pocket flow for trench capacitors integrated with planar capacitors...
- Patent number 11,996,438
- Issue date May 28, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- G11 - INFORMATION STORAGE
Information Patent Grant
Planar and trench capacitors with hydrogen barrier dielectric for l...
- Patent number 11,985,832
- Issue date May 14, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,961,877
- Issue date Apr 16, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,955,512
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
- Patent number 11,942,365
- Issue date Mar 26, 2024
- Eugenus, Inc.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a perovskite-material based planar capacitor...
- Patent number 11,908,704
- Issue date Feb 20, 2024
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a perovskite-material based trench capacitor...
- Patent number 11,894,417
- Issue date Feb 6, 2024
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual hydrogen barrier layer for memory devices
- Patent number 11,869,928
- Issue date Jan 9, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated trench and via electrode for memory device applications...
- Patent number 11,869,843
- Issue date Jan 9, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-level hydrogen barrier layers for memory applications
- Patent number 11,871,584
- Issue date Jan 9, 2024
- Kepler Computing Inc.
- Noriyuki Sato
Information Patent Grant
Integrated trench and via electrode for memory device applications
- Patent number 11,862,517
- Issue date Jan 2, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive and insulative hydrogen barrier layer for memory devices
- Patent number 11,844,203
- Issue date Dec 12, 2023
- Kepler Computing Inc.
- Noriyuki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual hydrogen barrier layer for memory devices integrated with low...
- Patent number 11,844,225
- Issue date Dec 12, 2023
- Kepler Computing Inc.
- Noriyuki Sato
Information Patent Grant
High density dual encapsulation materials for capacitors and method...
- Patent number 11,839,070
- Issue date Dec 5, 2023
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated via and bridge electrodes for memory array applications...
- Patent number 11,839,088
- Issue date Dec 5, 2023
- Kepler Computing Inc.
- Noriyuki Sato
Information Patent Grant
Titanium silicon nitride barrier layer
- Patent number 11,832,537
- Issue date Nov 28, 2023
- Eugenus, Inc.
- Jae Seok Heo
Information Patent Grant
Rapid thermal annealing (RTA) methodologies for integration of pero...
- Patent number 11,769,790
- Issue date Sep 26, 2023
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device fabrication through wafer bonding
- Patent number 11,765,908
- Issue date Sep 19, 2023
- Kepler Computing Inc.
- Mauricio Manfrini
Information Patent Grant
Iterative monetization of process development of non-linear polar m...
- Patent number 11,741,428
- Issue date Aug 29, 2023
- Kepler Computing Inc.
- Sasikanth Manipatruni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smooth titanium nitride layers and methods of forming the same
- Patent number 11,587,784
- Issue date Feb 21, 2023
- Eugenus, Inc.
- Sung-Hoon Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal and smooth titanium nitride layers and methods of forming...
- Patent number 11,482,413
- Issue date Oct 25, 2022
- Eugenus, Inc.
- Sung-Hoon Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MEMORY DEVICE FABRICATION THROUGH ITERATIVE MULTILAYER ST...
- Publication number 20240347397
- Publication date Oct 17, 2024
- Kepler Computing Inc.
- Sasikanth Manipatruni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICES INCLUDING B-SITE DOPANTS AND L...
- Publication number 20240276734
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED CAPACITORS THROUGH WAFER BONDING
- Publication number 20240274651
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING
- Publication number 20240276735
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM SILICON NITRIDE BARRIER LAYER
- Publication number 20240276896
- Publication date Aug 15, 2024
- EUGENUS, INC.
- Jae Seok Heo
Information Patent Application
ITERATIVE MONETIZATION OF PRECURSOR IN PROCESS DEVELOPMENT OF NON-L...
- Publication number 20240211872
- Publication date Jun 27, 2024
- Kepler Computing Inc.
- Sasikanth Manipatruni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING THE SAME
- Publication number 20230395369
- Publication date Dec 7, 2023
- EUGENUS, INC.
- Sung-Hoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAIN COUPLED NON-LINEAR POLAR MATERIAL BASED CAPACITORS FOR MEMORY...
- Publication number 20230301113
- Publication date Sep 21, 2023
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PEROVSKITE-MATERIAL BASED PLANAR CAPACITOR...
- Publication number 20230298905
- Publication date Sep 21, 2023
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PEROVSKITE-MATERIAL BASED TRENCH CAPACITOR...
- Publication number 20230246064
- Publication date Aug 3, 2023
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID THERMAL ANNEALING (RTA) METHODOLOGIES FOR INTEGRATION OF PERO...
- Publication number 20230246063
- Publication date Aug 3, 2023
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID THERMAL ANNEALING (RTA) METHODOLOGIES FOR INTEGRATION OF PERO...
- Publication number 20230246062
- Publication date Aug 3, 2023
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL AND SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING...
- Publication number 20230215725
- Publication date Jul 6, 2023
- EUGENUS, INC.
- Sung-Hoon Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DUAL HYDROGEN BARRIER LAYER FOR MEMORY DEVICES
- Publication number 20230187476
- Publication date Jun 15, 2023
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACT...
- Publication number 20230016016
- Publication date Jan 19, 2023
- EUGENUS, INC.
- Alex Finkelman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...
- Publication number 20220415709
- Publication date Dec 29, 2022
- EUGENUS, INC.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACT...
- Publication number 20210125849
- Publication date Apr 29, 2021
- EUGENUS, INC.
- Alex Finkelman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING THE SAME
- Publication number 20210104397
- Publication date Apr 8, 2021
- EUGENUS, INC.
- Sung-Hoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...
- Publication number 20210104433
- Publication date Apr 8, 2021
- EUGENUS, INC.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL AND SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING...
- Publication number 20210104396
- Publication date Apr 8, 2021
- EUGENUS, INC.
- Sung-Hoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM SILICON NITRIDE BARRIER LAYER
- Publication number 20210104665
- Publication date Apr 8, 2021
- EUGENUS, INC.
- Jae Seok Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...
- Publication number 20180350657
- Publication date Dec 6, 2018
- EUGENUS, INC.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS

Somilkumar J. Rathi

Person

Patents Grantslast 30 patents

Conformal titanium nitride-based thin films and methods of forming...

Iterative monetization of precursor in process development of non-l...

Rapid thermal annealing (RTA) methodologies for integration of pero...

Iterative method of multilayer stack development for device applica...

Trench capacitors with continuous dielectric layer and methods of f...

Planar and trench capacitors with hydrogen barrier dielectric for l...

Planar and trench capacitors for logic and memory applications and...

Planar and trench capacitors for logic and memory applications

Multi-level hydrogen barrier layers for memory applications and met...

Pocket flow for trench capacitors integrated with planar capacitors...

Planar and trench capacitors with hydrogen barrier dielectric for l...

Dual hydrogen barrier layer for trench capacitors integrated with l...

Dual hydrogen barrier layer for trench capacitors integrated with l...

Multi-region diffusion barrier containing titanium, silicon and nit...

Method of fabricating a perovskite-material based planar capacitor...

Method of fabricating a perovskite-material based trench capacitor...

Dual hydrogen barrier layer for memory devices

Integrated trench and via electrode for memory device applications...

Multi-level hydrogen barrier layers for memory applications

Integrated trench and via electrode for memory device applications

Conductive and insulative hydrogen barrier layer for memory devices

Dual hydrogen barrier layer for memory devices integrated with low...

High density dual encapsulation materials for capacitors and method...

Integrated via and bridge electrodes for memory array applications...

Titanium silicon nitride barrier layer

Rapid thermal annealing (RTA) methodologies for integration of pero...

Memory device fabrication through wafer bonding

Iterative monetization of process development of non-linear polar m...

Smooth titanium nitride layers and methods of forming the same

Conformal and smooth titanium nitride layers and methods of forming...

Patents Applicationslast 30 patents

METHOD OF MEMORY DEVICE FABRICATION THROUGH ITERATIVE MULTILAYER ST...

METHOD OF FABRICATING MEMORY DEVICES INCLUDING B-SITE DOPANTS AND L...

METHOD OF FORMING STACKED CAPACITORS THROUGH WAFER BONDING

METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING

TITANIUM SILICON NITRIDE BARRIER LAYER

ITERATIVE MONETIZATION OF PRECURSOR IN PROCESS DEVELOPMENT OF NON-L...

SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING THE SAME

DRAIN COUPLED NON-LINEAR POLAR MATERIAL BASED CAPACITORS FOR MEMORY...

METHOD OF FABRICATING A PEROVSKITE-MATERIAL BASED PLANAR CAPACITOR...

METHOD OF FABRICATING A PEROVSKITE-MATERIAL BASED TRENCH CAPACITOR...

RAPID THERMAL ANNEALING (RTA) METHODOLOGIES FOR INTEGRATION OF PERO...

RAPID THERMAL ANNEALING (RTA) METHODOLOGIES FOR INTEGRATION OF PERO...

CONFORMAL AND SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING...

DUAL HYDROGEN BARRIER LAYER FOR MEMORY DEVICES

SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACT...

CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...

SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACT...

SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING THE SAME

CONFORMAL TITANIUM NITRIDE-BASED THIN FILMS AND METHODS OF FORMING...

CONFORMAL AND SMOOTH TITANIUM NITRIDE LAYERS AND METHODS OF FORMING...

TITANIUM SILICON NITRIDE BARRIER LAYER

MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...