Son K. Tran

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,049,841
- Issue date Jun 29, 2021
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 10,014,273
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 9,455,234
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 8,759,151
- Issue date Jun 24, 2014
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 8,188,597
- Issue date May 29, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,408,264
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,119,003
- Issue date Oct 10, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 7,109,592
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension of fatigue life for C4 solder ball to chip connection
- Patent number 7,067,916
- Issue date Jun 27, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,777,817
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
SMT passive device noflow underfill methodology and structure
- Patent number 6,739,497
- Issue date May 25, 2004
- International Busines Machines Corporation
- Clément J. Fortin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,713,858
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,617,698
- Issue date Sep 9, 2003
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,596,559
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for making an encapsulated semiconductor chip module
- Patent number 6,558,981
- Issue date May 6, 2003
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly
- Patent number 6,348,738
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Jean Dery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a flip chip assembly, and a flip chip assembly fo...
- Patent number 6,306,683
- Issue date Oct 23, 2001
- International Business Machines Corporation
- Jean Dery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,248,614
- Issue date Jun 19, 2001
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulated chip module and method of making same
- Patent number 6,246,124
- Issue date Jun 12, 2001
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of solder bumps and solder connections
- Patent number 6,100,114
- Issue date Aug 8, 2000
- International Business Machines Corporation
- Cynthia S. Milkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a flip chip assembly
- Patent number 6,074,895
- Issue date Jun 13, 2000
- International Business Machines Corporation
- Jean Dery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier processing and shipping array and method of manufactur...
- Patent number 6,021,904
- Issue date Feb 8, 2000
- International Business Machines Corporation
- John E. Kozol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
- Publication number 20210288022
- Publication date Sep 16, 2021
- International Business Machines Corporation
- William EMMETT BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20180350768
- Publication date Dec 6, 2018
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
- Publication number 20170358552
- Publication date Dec 14, 2017
- International Business Machines Corporation
- William E. BREINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20160329297
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...
- Publication number 20160233190
- Publication date Aug 11, 2016
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20140197228
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas E. LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer for ESD, EMI, and EMC
- Publication number 20130082365
- Publication date Apr 4, 2013
- International Business Machines Corporation
- WILLIAM E. BERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120187180
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY
- Publication number 20120070940
- Publication date Mar 22, 2012
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus for Assembling Integrated Circuit Device Util...
- Publication number 20090085202
- Publication date Apr 2, 2009
- Bing Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a circuitized substrate having a plurality of sold...
- Publication number 20070090170
- Publication date Apr 26, 2007
- Endicott Interconnect Technologies, Inc.
- Steven W. Anderson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20060290008
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20050224973
- Publication date Oct 13, 2005
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20040180469
- Publication date Sep 16, 2004
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20040041280
- Publication date Mar 4, 2004
- International Business Machines Corporation
- Stephen L. Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SMT passive device noflow underfill methodology and structure
- Publication number 20030209590
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Clement J. Fortin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20030203535
- Publication date Oct 30, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Extension of fatigue life for C4 solder ball to chip connection
- Publication number 20020195707
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20020171132
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Stephen Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making an encapsulated semiconductor chip module
- Publication number 20010026959
- Publication date Oct 4, 2001
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20010012642
- Publication date Aug 9, 2001
- International Business Machines Corporation
- Ramesh R. Kodnani
- H01 - BASIC ELECTRIC ELEMENTS

Son K. Tran

Person

Patents Grantslast 30 patents

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Fixture to constrain laminate and method of assembly

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Fixture to constrain laminate and method of assembly

Fixture to constrain laminate and method of assembly

Fixture to constrain laminate and method of assembly

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

Reworkable and thermally conductive adhesive and use thereof

SMT passive device noflow underfill methodology and structure

Flip-chip package with optimized encapsulant adhesion and method

Reworkable and thermally conductive adhesive and use thereof

Flip-chip package with optimized encapsulant adhesion and method

Method for making an encapsulated semiconductor chip module

Flip chip assembly

Method of forming a flip chip assembly, and a flip chip assembly fo...

Flip-chip package with optimized encapsulant adhesion and method

Encapsulated chip module and method of making same

Encapsulation of solder bumps and solder connections

Method of forming a flip chip assembly

Chip carrier processing and shipping array and method of manufactur...

Patents Applicationslast 30 patents

Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shieldin...

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

Interposer for ESD, EMI, and EMC

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY

Methods and Apparatus for Assembling Integrated Circuit Device Util...

Method of making a circuitized substrate having a plurality of sold...

SMT passive device noflow underfill methodology and structure

Extension of fatigue life for C4 solder ball to chip connection

SMT passive device noflow underfill methodology and structure

Reworkable and thermally conductive adhesive and use thereof

SMT passive device noflow underfill methodology and structure

Flip-chip package with optimized encapsulant adhesion and method

Extension of fatigue life for C4 solder ball to chip connection

Reworkable and thermally conductive adhesive and use thereof

Method for making an encapsulated semiconductor chip module

Flip-chip package with optimized encapsulant adhesion and method