Song GAO

Follow

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20180204825
- Publication date Jul 19, 2018
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20160035689
- Publication date Feb 4, 2016
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS