SONG GUO

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,551,948
- Issue date Jan 10, 2023
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip bonding device and bonding method thereof
- Patent number 11,037,900
- Issue date Jun 15, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding device and bonding method
- Patent number 10,903,105
- Issue date Jan 26, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal chip batch-bonding apparatus and method
- Patent number 10,770,320
- Issue date Sep 8, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and method
- Patent number 10,748,800
- Issue date Aug 18, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuebin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for transmitting information in relay communicati...
- Patent number 9,219,537
- Issue date Dec 22, 2015
- ZTE Corporation
- Yu-Qin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20200273730
- Publication date Aug 27, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Feibiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CHIP BATCH-BONDING APPARATUS AND METHOD
- Publication number 20200013647
- Publication date Jan 9, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING DEVICE AND BONDING METHOD
- Publication number 20200013656
- Publication date Jan 9, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO.,LTD.
- Feibiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A CHIP BONDING DEVICE AND BONDING METHOD THEREOF
- Publication number 20190164930
- Publication date May 30, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Song GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND METHOD
- Publication number 20190088516
- Publication date Mar 21, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuebin ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR TRANSMITTING INFORMATION IN RELAY COMMUNICATI...
- Publication number 20130077557
- Publication date Mar 28, 2013
- ZTE CORPORATION
- Yu-Qin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROTOCOL INTERWORKING DEVICE FOR NETWORK TELEPHONE SYSTEM AND METHO...
- Publication number 20120246328
- Publication date Sep 27, 2012
- HON HAI Precision Industry CO., LTD.
- JUN SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MODEM SYSTEM AND METHOD
- Publication number 20090316703
- Publication date Dec 24, 2009
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- JUN SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus

Chip bonding device and bonding method thereof

Flip chip bonding device and bonding method

Universal chip batch-bonding apparatus and method

Batch bonding apparatus and bonding method

Chip bonding apparatus and method

Method and system for transmitting information in relay communicati...

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS

UNIVERSAL CHIP BATCH-BONDING APPARATUS AND METHOD

FLIP CHIP BONDING DEVICE AND BONDING METHOD

BATCH BONDING APPARATUS AND BONDING METHOD

A CHIP BONDING DEVICE AND BONDING METHOD THEREOF

CHIP BONDING APPARATUS AND METHOD

METHOD AND SYSTEM FOR TRANSMITTING INFORMATION IN RELAY COMMUNICATI...

PROTOCOL INTERWORKING DEVICE FOR NETWORK TELEPHONE SYSTEM AND METHO...

MODEM SYSTEM AND METHOD