Song NA

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Jeonju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating semiconductor packages by using a mold pres...
- Patent number 11,501,981
- Issue date Nov 15, 2022
- SK hynix Inc.
- Kyung Beom Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including diffusion barriers over sidewalls of throu...
- Patent number 9,257,413
- Issue date Feb 9, 2016
- SK Hynix Inc.
- Seung Taek Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE STACK STRUCTURE
- Publication number 20240186291
- Publication date Jun 6, 2024
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES
- Publication number 20220115247
- Publication date Apr 14, 2022
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150061120
- Publication date Mar 5, 2015
- SK HYNIX INC.
- Seung Taek YANG
- H01 - BASIC ELECTRIC ELEMENTS