Song Wu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for selecting wafer locations to characterize c...
- Patent number 12,085,515
- Issue date Sep 10, 2024
- KLA Corporation
- Brian C. Lin
- G01 - MEASURING TESTING
Information Patent Grant
Loosely-coupled inspection and metrology system for high-volume pro...
- Patent number 11,562,289
- Issue date Jan 24, 2023
- KLA Corporation
- Song Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Restoring from a legacy OS environment to a UEFI pre-boot environment
- Patent number 9,372,754
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Adam L. Soderlund
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Restoring from a legacy OS environment to a UEFI pre-boot environment
- Patent number 9,081,734
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Adam L. Soderlund
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Receiving multi-frequency data in high speed downlink packet access...
- Patent number 8,054,786
- Issue date Nov 8, 2011
- Shanghai Ultimate Power Communications Technology Co., Ltd.
- Song Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Calibration Of Parametric Measurement Models Based On In-Line Wafer...
- Publication number 20240102941
- Publication date Mar 28, 2024
- KLA Corporation
- Brian C. Lin
- G01 - MEASURING TESTING
Information Patent Application
Methods And Systems For Selecting Wafer Locations To Characterize C...
- Publication number 20230063102
- Publication date Mar 2, 2023
- KLA Corporation
- Brian C. Lin
- G01 - MEASURING TESTING
Information Patent Application
Fleet Matching Of Semiconductor Metrology Tools Without Dedicated Q...
- Publication number 20210375651
- Publication date Dec 2, 2021
- KLA Corporation
- Song Wu
- G01 - MEASURING TESTING
Information Patent Application
Loosely-Coupled Inspection and Metrology System for High-Volume Pro...
- Publication number 20200184372
- Publication date Jun 11, 2020
- KLA-Tencor Corporation
- Song Wu
- G01 - MEASURING TESTING
Information Patent Application
RESTORING FROM A LEGACY OS ENVIRONMENT TO A UEFI PRE-BOOT ENVIRONMENT
- Publication number 20150227427
- Publication date Aug 13, 2015
- International Business Machines Corporation
- ADAM L. SODERLUND
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESTORING FROM A LEGACY OS ENVIRONMENT TO A UEFI PRE-BOOT ENVIRONMENT
- Publication number 20130290778
- Publication date Oct 31, 2013
- International Business Machines Corporation
- ADAM L. SODERLUND
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RECEIVING MULTI-FREQUENCY DATA IN HIGH SPEED DOWNLINK PACKET ACCESS...
- Publication number 20080165724
- Publication date Jul 10, 2008
- Song Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Methods and systems for selecting wafer locations to characterize c...

Loosely-coupled inspection and metrology system for high-volume pro...

Restoring from a legacy OS environment to a UEFI pre-boot environment

Restoring from a legacy OS environment to a UEFI pre-boot environment

Receiving multi-frequency data in high speed downlink packet access...

Patents Applicationslast 30 patents

Calibration Of Parametric Measurement Models Based On In-Line Wafer...

Methods And Systems For Selecting Wafer Locations To Characterize C...

Fleet Matching Of Semiconductor Metrology Tools Without Dedicated Q...

Loosely-Coupled Inspection and Metrology System for High-Volume Pro...

RESTORING FROM A LEGACY OS ENVIRONMENT TO A UEFI PRE-BOOT ENVIRONMENT

RESTORING FROM A LEGACY OS ENVIRONMENT TO A UEFI PRE-BOOT ENVIRONMENT

RECEIVING MULTI-FREQUENCY DATA IN HIGH SPEED DOWNLINK PACKET ACCESS...