Songlin LI

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,426,036
- Issue date Sep 24, 2019
- Huawei Technologies Co., Ltd.
- Songlin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power tube connection structure of power amplifier and power amplifier
- Patent number 10,165,687
- Issue date Dec 25, 2018
- Huawei Technologies Co., Ltd.
- Songlin Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multi-layer printed circuit board and method for fabricating multi-...
- Patent number 9,510,449
- Issue date Nov 29, 2016
- Huawei Technologies Co., Ltd.
- Mingli Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER
- Publication number 20190223293
- Publication date Jul 18, 2019
- Huawei Technologies Co., Ltd
- Songlin LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER TUBE CONNECTION STRUCTURE OF POWER AMPLIFIER AND POWER AMPLIFIER
- Publication number 20170347457
- Publication date Nov 30, 2017
- Huawei Technologies Co., Ltd
- Songlin LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Printed Circuit Board and Method for Fabricating Multi-...
- Publication number 20140345932
- Publication date Nov 27, 2014
- Mingli Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH THE FUNCTION OF SUPPORTING MULTIPLE CARDS
- Publication number 20120225621
- Publication date Sep 6, 2012
- O2Micro, Inc.
- Songlin LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE